Hydrogen RF-plasma and laser processing of structural defects in silicon facilitating the lift-off of single-crystal layers thinner than 50 nm.

Publication type: 
Patent
Authors: 
C. Ghica, L. C. Nistor, V. S. Teodorescu, S. Vizireanu, N. D. Scarisoreanu
Number of authors: 
5
Year: 
2009

Patent data

OSIM no.: 
10.09.2009